Huawei had been in shambles since the US ban prohibited them from accessing US supply chains that could help them build their own Kirin chips.
Huawei can’t do business with TSMC anymore, which is a contractor that helps make powerful 5nm Kirin chips for them.
With that, there had been reports that Huawei will build chips all by themselves.
The report suggests that Huawei may start its own wafer fab in Wuhan, China. Production may start in phases starting next year, 2022. The success of this is plausible since Huawei’s chipmaking arm, HiSilicon apparently has the capability to do so.
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Those who are familiar know that making powerful chips like the Kirin 9000 of the Huawei Mate 40 series and MatePad Pro 12.6 requires silicon-made wafers to undergo different processes before being sliced and made into individual chipsets.