MediaTek has unveiled a new member of the Dimensity 8000 series that will power sub-flagship phones of next year. Meet the new MediaTek Dimensity 8300, which was built using TSMC’s 2nd generation 4nm process.
MediaTek has unveiled a new member of the Dimensity 8000 series that will power sub-flagship phones of next year. Meet the new MediaTek Dimensity 8300, which was built using TSMC’s 2nd generation 4nm process.