The MediaTek Dimensity 820 processor was just revealed as another feature-packed chipset geared for upper midrange smartphones. An already follow-up to the Dimensity 800 from January that’s yet to come out on a market-ready device. It will sit between the flagship Dimensity 1000 series and the gamer-centric Helio G90 series.

It’s built on a 7nm TSMC FinFET process. The MediaTek Dimensity 820 has four 2.6GHz ARM Cortex-A76 performance cores and four 2GHz Cortex-A55 efficiency cores. Handling the graphics is a Mali-G57 GPU.

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The MediaTek HyperEngine 2.0 Gaming technology optimizes the network, and display reponse times and quality for improved gaming.

Speaking of the display, the Dimensity 820 can support 120Hz screens, so expect smooth refresh rates on affordable midrange phones in the future.

Probably its biggest feature is the sub-6GHz Dual 5G SIM support with VoNR. Just like the Exynos 980 and Snapdragon 765G, it will bring the latest, ultra-fast network connectivity to more affordable smartphones. It has MediaTek 5G UltraSave technology, which the company claims is the world’s most power-efficient 5G modem for better battery life.

The MediaTek Dimensity 820 also has the company’s APU 3.0 technology for improved AI prowess; and MiraVision Video Playback that can enhance SDR videos to HDR.

It also supports up to 80-megapixel sensors or two 40-megapixel cameras. 4K HDR video recording is also supported.

Xiaomi claims that the upcoming Redmi 10X will be the first to use the new MediaTek Dimensity 820 processor. The release details is yet to be announced.



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